Method for making a ceramic lid for hermetic sealing of an EPROM circuit
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United States of America Patent
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Aug 27, 1991
Grant Date -
N/A
app pub date -
Aug 29, 1990
filing date -
Aug 29, 1990
priority date (Note) -
Expired
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Abstract
An assembly structure and a method for making a ceramic lid for a hermetically sealed package for an EPROM circuit are disclosed. The assembly structure includes, in combination, a ceramic lid, a UV transparent lens, and two fixtures for supporting the lens in the lid. The two fixtures are configured to contact the lens only at predetermined areas which are not crucial to UV transparency. The UV transparent lens is hermetically sealed to the ceramic lid by firing the assembly structure. The assembly structure prevents the lens from attracting foreign particulate matter during firing, thereby leaving the surfaces of the lens clean. The method provides a ceramic lid having a UV transparent lens hermetically sealed thereto, which finds wide use in integrated circuit packages for high-density EPROM's because of the untainted surfaces of the lens.
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- 15 United States
- 10 France
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Patent Owner(s)
- KYOCERA AMERICA, INC.
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- Non-US Classification not provided for expired patents
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
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Miyauchi, Nobuaki | San Diego, CA | 10 | 71 |
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Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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