Release sheet for printed circuit board manufacture
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United States of America Patent
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-
Aug 27, 1991
Issued Date -
N/A
app pub date -
Jun 14, 1990
filing date -
Nov 3, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A process and nylon release sheet for manufacturing printed circuit boards from epoxy prepregs is disclosed. In such process layers of the prepregs are separated from one another by a release sheet. The release sheet comprises an aliphatic or aromatic nylon or nylon copolymer which is a condensation product of a dicarboxylic acid and a diamine. The nylon film contains a heat stabilizer and an inorganic particulate antiblock additive, e.g. diatomaceous earth, glass beads, amorphous silica, talc, mica and molybdenum disulphide. The nylon may be toughened by the addition of a phosphorus-containing catalyst or an epoxide.
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