Wire bonding method and apparatus

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United States of America Patent

PATENT NO 5044543
SERIAL NO

07485266

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Abstract

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A wire bonding apparatus including a horn with a bonding tool at one end and a vibrator at the other end, an automatic tracking type ultrasonic oscillating power supply which supplies power to the vibrator and tracks changes in the resonance frequency of the horn by feeding back the error voltage generated by changes in the resonance frequency of the vibrator, a bonding head supporting the horn so that the horn can move vertically and horizontally, an X-Y table which drives the bonding head in the X and Y directions, and an arithmetic unit which converts the error voltage of the ultrasonic oscillating power supply into a coordinate error and corrects the bonding coordinates. Using such a bonding apparatus, changes in the resonance frequency of the vibrator are converted into an amount of expansion or contraction of the horn, such an amount is calculated, and the bonding coordinates are corrected, so that an X-Y table is driven in accordance with these corrected bonding coordinates to bring the bonding tool to a correct bonding point.

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Patent Owner(s)

Patent OwnerAddress
KABUSHIKI KAISHA SHINKAWA2-51-1 INADAIRA MUSASHI MURAYAMA-SHI TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ushiki, Hiroshi Tokyo, JP 22 123
Yamazaki, Mikiya Tokyo, JP 1 16

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