Non-ionic, water washable soldering paste
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United States of America Patent
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-
Sep 3, 1991
Grant Date -
N/A
app pub date -
Jun 4, 1990
filing date -
Jun 4, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Improved soldering paste for the surface mounting of electronic components comprises a novel fluxing agent selected from quaternary ammonium hydroxides and mixtures thereof. Use of these agents as fluxes eliminates the problem of ionic residues on circuit boards and permits the boards to be washed with water to remove any non-ionic residues.
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