Micromachined bonding surfaces and method of forming the same
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United States of America Patent
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Sep 3, 1991
Grant Date -
N/A
app pub date -
Oct 17, 1989
filing date -
Oct 17, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of encapsulating a lead bonding pad region of an integrated circuit (such as a sensor used in an implantable medical device) is disclosed. The excapsulant (such as Teflon.TM.-TFE) is mechanically gripped on the surface of the circuit by anchor interlock portions which are held in undercut grooves, micromachined, in a predefined pattern, in the circuit substrate. The encapsulant is held down by the portions in the grooves, forms a tight mechanical seal with the substrate surface and with the insulation around an attached lead, and blocks intrusion of contaminants along the surfaces between these materials or through the encapsulant.
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