Pin grid array package
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United States of America Patent
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-
Sep 3, 1991
Grant Date -
N/A
app pub date -
Aug 21, 1990
filing date -
Aug 21, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A pin grid array package having a substrate formed from a ceramics containing a 90% or higher alumina composition. The substrate has an palladium-silver layer on an upper surface thereof with a silver layer further provided on the Pd-Ag layer and a gold bonding pad on a outer periphery of a cavity of the substrate so as to provide electrical connection between pins and chip. The Ag layer is covered with a dielectric layer to prevent contamination from moisture.
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Cited Art Landscape
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