Printed wiring boards with superposed copper foils cores
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United States of America Patent
Stats
-
Sep 3, 1991
Grant Date -
N/A
app pub date -
Apr 17, 1990
filing date -
Apr 20, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The invention provides a printed wiring board having a plurality of copper foil cores superposed over one another and spaced away from one another. The portions of the cores are exposed at the end surfaces of the board. A plurality of holes extend vertically through the copper foil cores and have hole-defining internal surfaces so plated as to connect the cores to one another. Another printed wiring board has a plurality of copper foil cores superposed over one another and spaced away from one another. The end portions of the cores are exposed at the end surfaces of the board. A plurality of holes extend vertically through the copper foil cores and have hole-defining internal surfaces so plated as to connect the cores to one another. The underside of the copper foil core at the lowermost position is exposed at a recess formed on the rear side of the board. Plating is formed which extends from the lowermost copper foil core to the rear side of the board.
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Cited Art Landscape
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