Installation structure of integrated circuit devices
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United States of America Patent
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-
Sep 3, 1991
Grant Date -
N/A
app pub date -
Sep 17, 1990
filing date -
Sep 20, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An installation structure of integrated circuit devices, in which two or more types of integrated circuit devices of different base materials are installed onto the same installation substrate. Since the installation structure has a construction according to different characteristics such as a thermal conductivity, heat generation amount, thermal expansion coefficient and the like of the integrated circuit devices made of different materials, the reliability of each device and its connection and the reduction of the costs required for the cooling method can be presented.
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