Wiring design for semiconductor integrated circuit

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United States of America Patent

PATENT NO 5046017
SERIAL NO

07287059

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Abstract

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A method of designing semiconductor integrated circuits wherein rough routes are designated after a process of design for cells layout is completed, then wirings between cells are supposed automatically on the basis of the designated rough routes, investigation of the characteristic of the wirings is executed, and after a target characteristic is attained, a wiring pattern satisfying all of required electrical and physical conditions, including layout rules, i.e. a detailed wiring pattern, is prepared.

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Patent Owner(s)

  • HITACHI, LTD.;HITACHI MICROCOMPUTER ENGINEERING LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nishizawa, Kouichi Aizuwakamatsu, JP 1 59
Yuyama, Kyoji Shiroyama, JP 2 182

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