Method of manufacturing a multilayer circuit board
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United States of America Patent
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-
Sep 10, 1991
Grant Date -
N/A
app pub date -
Mar 15, 1990
filing date -
Mar 15, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Methods of fabricating multilayer circuits are presented. In accordance with the present invention, a plurality of circuit layers comprised of a dielectric substrate having a circuit formed thereon are stacked, one on top of the other. The dielectric substrate is composed of a polymeric material capable of undergoing fusion bonding such as a fluoropolymeric based substrate. Fusible conductive bonding material (e.g. solder) is applied on selected exposed circuit traces (prior to the stacking step) whereupon the entire stack-up is subjected to lamination under heat and pressure to simultaneously fuse all of the substrate and conductive layers together to form an integral multilayer circuit having solid conductive interconnects.
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