Process for the production of metal clad thermoplastic base materials and printed circuits on thermoplastic base materials
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 10, 1991
Issued Date -
N/A
app pub date -
Feb 21, 1989
filing date -
Nov 2, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A process for bonding metal directly to thermoplastic polymeric base materials and a process for producing printed circuits from such metal clad thermoplastic polymeric base materials are provided. The invention also includes the articles so produced. Metal clad thermoplastic polymeric base materials are produced by laminating a metal foil or sheet to thermoplastic polymeric base material, under pressure, at a temperature from about 2.degree. C. to about 45.degree. C. above the glass transition temperature (Tg) of the thermoplastic. The polymeric material is free of volatile materials such as moisture or solvents when laminated.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully