Field emitter array integrated circuit chip interconnection
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United States of America Patent
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-
Sep 10, 1991
Grant Date -
N/A
app pub date -
May 22, 1990
filing date -
May 22, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A separable assembly for connecting and mounting an integrated circuit chip (10) to a chip carrier substrate (12) utilizing the principle of field emitter current induction. Transmitting zones (14, 26, 28) on the chip (10) and substrate (12) are formed as recessed arrays of field emitter projections (30, 32) and the respective receiving zones (24, 16, 18) are planar conductive films. The chip (10) and the substrate (12) are separably connected with the respective transmitting and receiving zones in alignment with each other.
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