Alignment--registration tool for fabricating multi-layer electronic packages
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United States of America Patent
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Sep 17, 1991
Grant Date -
N/A
app pub date -
Oct 23, 1990
filing date -
Oct 23, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Disclosed is a method of forming a multilayer microelectronic circuit package. According to the disclosed method, the first layer of the package has features that are brought into proximity to an optical system which is adapted for imaging a surface of the layer. The optical system images features on the surface of the first layer, and generates targets around selected ones of the features. The, the next layer of the circuit package is brought into proximity to the optical system. This next layer is moved, i.e., translated and rotated, until selected features of the layer coincide with the targets generated through the optical system. This next layer is then placed atop the previous layer. Finally, the layers are laminated to form the multilayer microelectronic circuit package.
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