Methods for removing stringers appearing in copper-containing multi-layer printed wiring boards
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United States of America Patent
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Sep 17, 1991
Issued Date -
N/A
app pub date -
Feb 8, 1988
filing date -
Jan 30, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Copper-containing multilayer substrates are etched, and stringers formed in the plated through-holes in these substrates are simultaneously removed by treatment with an aqueous composition including about 37% by weight hydrofluoric acid and about 16% by weight nitric acid. The same aqueous composition can be used to remove stringers formed during treatment of such substrates with other etchants.
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