Automated method for the manufacture of transponder devices by winding around a bobbin
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United States of America Patent
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Sep 24, 1991
Grant Date -
N/A
app pub date -
May 25, 1990
filing date -
May 25, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An improved automated method for the manufacture of alternatively sized passive transponder devices is presented which utilizes a single leadframe design and manufacturing process, including automated coil winding and wire-to-lead termination. A specially designed leadframe is prepared, with augmented leads, and is coated with a thin layer of silver. One or more semiconductor chips are bonded to individual assembly sites on the leadframe, after which the lead-die assembly is encapsulated by transfer molding. The cap and leads are singulated, and a bobbin is attached to the leads, which extend laterally from each individual molded cap. In an automated process, a conductive wire is attached to a first of the protruding leads, fly-wound around the bobbin core, and terminated by connection to a second of the protruding leads.
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