Silicone resin electronic device encapsulant
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United States of America Patent
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Sep 24, 1991
Grant Date -
N/A
app pub date -
Nov 9, 1989
filing date -
Nov 9, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronic device is encapsulated by a curable material which, prior to cure, consists essentially of (a) 33 to 39 percent of a silicone resin selected from the group consisting of (i) polydimethylsiloxane, containing a platinum catalyst and having functional components selected from the group consisting of vinyl and hydride functional components, (ii) polymethylphenylsiloxane containing a platinum catalyst and having functional components selected from the group consisting of vinyl and hydride functional components, and (iii) a mixture of (i) and (ii), (b) 51 to 57 weight percent of silicon dioxide and (c) 8 to 12 weight percent of a low vapor pressure organic solvent, preferably an alcohol ester.
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