Method for producing semiconductor device and semiconductor device produced thereby

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United States of America Patent

PATENT NO 5051376
SERIAL NO

07463642

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Abstract

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A method for producing a semiconductor device comprises the steps of: preparing a III.sub.b -V.sub.b group compound single crystalline semiconductor substrate produced by a liquid encapsulated Czochralski process, the single crystalline semiconductor substrate having a carbon concentration of 1.times.10.sup.15 cm.sup.-3 or less, implanting conductive impurity ions into the single crystalline semiconductor substrate and then annealing, and a semiconductor device produced by this method.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI KASEI CORPORATIONTOKYO JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ibuka, Toshihiko Tsuchiura, JP 4 101
Kawabata, Shin-ichiro Tsuchiura, JP 3 7
Orito, Fumio Tsuchiura, JP 5 51
Seta, Yuichi Tokyo, JP 1 3
Yamada, Yutaka Tsuchiura, JP 164 2452

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