Bonding electrical conductors
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Oct 8, 1991
Grant Date -
N/A
app pub date -
Jul 10, 1990
filing date -
Jul 11, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of bonding an electrical conductor to a contact of an integrated circuit (IC) device comprises bonding the conductor to a support member and to a contact of the IC device. The conductor is then severed to release the IC device and conductor from the support. This allows the IC device to be tested while connected to the support member and provides it with a conductor lead for connection to a carrier for use.
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