Ionic semiconductor materials and applications thereof
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United States of America Patent
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Oct 8, 1991
Issued Date -
N/A
app pub date -
Jun 22, 1990
filing date -
Oct 6, 1986
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An electrode comprising: metallic electrode material; and a nonporous solid composite material encapsulating the electrode material, the composite material comprising an inert matrix material having hydrogel substantially uniformly dispersed therein, the hydrogel comprising 10% to approximately 50% by weight of the dry composite material, there being sufficient bonding between molecules of the hydrogel and the matrix material to prevent substantial leach-out of hydrogel molecules from the composite.
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