Method of forming a plurality of solder connections
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United States of America Patent
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-
Oct 15, 1991
Grant Date -
N/A
app pub date -
Jan 26, 1990
filing date -
Jan 26, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A solder interconnection for forming vias between first and second substrates comprises a plurality of solder containing wells extending into a flat surface of the first substrate, the solder in each well being soldered to one of a corresponding plurality of conductor posts extending outwardly from a flat surface of the second substrate. The plurality of the wells are created in a pattern, an aliquot of solder is deposited in each well, with the aliquots being of substantially no greater volume than that of the well it occupies, the posts are provided in aligned array with the pattern, the solder is melted, the posts are inserted and the solder solidifies. Very closely placed vias can be formed.
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