Importance

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Abstract

A chemical bath for immersing articles such as integrated circuit wafers in a hot flow of etchant or other liquid includes a liquid receptacle with a first compartment for receiving the articles and a second compartment which acts as sump and further includes a trough which channels overflow from the first compartment into the sump. A pump recirculates liquid from the sump back to the first compartment. The receptacle is supported by a casing in which the lower region of the receptacle is situated. The casing in which the lower region of the receptacle is situated. The casing is sealed by a flange on the receptacle which overlays a rim member on the casing and by sealing material situated between the rim member and the underside of the flange. The flange is located below the trough in vertically spaced apart relationship with the trough. This inhibits direct heat transfer from the trough to the seal and thereby enhances seal durability.

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First Claim