Thermal heat sink encapsulated integrated circuit
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United States of America Patent
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-
Oct 15, 1991
Issued Date -
N/A
app pub date -
Nov 8, 1990
filing date -
Jul 17, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An encapsulated integrated circuit which includes an integrated circuit die having a plurality of electric leads extending from the die. A thermal heat sink is positioned adjacent the die. The heat sink includes a thermoplastic material having a plurality of thermoconductive particles molded therein. A non-electrically conductive plastic material is sealably connected to the heat sink and encloses the die and seals around the leads. The heat sink plastic material is filled approximately 50 percent with metal particles, preferably in the form of powder. The particles may be from a group consisting of copper, aluminum, iron, carbon, aluminum nitride, silicon carbide, and boron nitride. The heat sink and the non-conductive plastic material have coacting interlocking interfaces.
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