Importance

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Abstract

A thin film electronic package which utilizes a circuitized substrate (e.g., a printed circuit board) having a flexible film carrier electrically coupled thereto. The film carrier includes a dielectric layer (e.g., polyimide) with first and second circuit layers located on opposite sides thereof. These circuit layers are interconnected, electrically, through the dielectric. An electronic device (e.g., semiconductor chip) is electrically connected to bridging portions of the conductive leads of the carrier's first circuit layer, which bridging portions extend across apertures provided within the dielectric. A plurality of solder elements are utilized to provide electrical connection between respective contact locations of the electronic device and respective bridging portions of the first layer's conductive leads.

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First Claim