Seed layer compositions containing organogold and organosilver compounds
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United States of America Patent
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Oct 22, 1991
Grant Date -
N/A
app pub date -
Apr 27, 1990
filing date -
Apr 27, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A fluid composition for producing a gold seed layer on a substrate for an electrical circuit, which comprises an organogold and an organosliver compound present as 0.5 to 10 parts by weight silver per 100 parts by weight gold. In preferred compositions the silver is present as 0.8 to 6 parts by weight per 100 parts gold. The process improves seed layer to substrate adhesion.
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