Wafer probe with transparent loading member
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United States of America Patent
Stats
-
Oct 22, 1991
Grant Date -
N/A
app pub date -
Aug 9, 1990
filing date -
Aug 9, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A probe head for establishing electrically conductive contact with an electronic device comprises a loading member having an attachment portion for attachment to a support structure. A cantilever arm is attached at a first end to the attachment portion and has a second end spaced from the attachment portion. A flexible sheet of insulating material is attached at a first end region to the second end of the cantilever arm with a first main face of the flexible sheet confronting the cantilever arm. A first array of contact elements is exposed at the second main face of the sheet at the first end region thereof, whereby the sheet of insulating material is between the cantilever arm and the contact elements of the first array. A second array of contact elements is exposed at a second end region of the sheet, spaced from the first end region, and conductor runs connect the contact elements of the first array with respective contact elements of the second array.
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