Apparatus for depositing a thin film of a sputtered material on a member

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United States of America Patent

PATENT NO 5061360
SERIAL NO

07470710

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Electrons released by an anode are attracted by an electric field toward a target cathode in a cavity to ionize argon atoms in the space between the anode and target. Magnets produce a magnetic field in the cavity in a direction perpendicular to the electrical field to produce a trapping spiral movement of the electrons in the cavity, thereby enhancing the ionization of the gaseous molecules. The ions bombard the target to emit sputtered atoms which are deposited on a semi-conductor wafer. The target may have a frusto-conical configuration defined by a single member or by a plurality of segmental tiles formed from different materials to provide for a deposition of a mixture of such different materials on the wafer. The target may be magnetizable. Under such circumstances, a permanent magnet may be disposed in the target with a polarity relative to the magnetic field to divert the magnetic field to the space external to the frusto-conical surface of the target so as to facilitate the ionization of atoms of the neutral gas by the electrons. Alternatively, the target may be hollow to provide a saturation of the magnetic field in the target and a resultant diversion of the magnetic field to the space external to the frusto-conical surface of the target to facilitate the trapping of the electrons in such space and the ionization of atoms of the neutral gas by the electrons.

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Patent Owner(s)

Patent OwnerAddress
SPUTTERED FILMS INC A CORP OF CASANTA BARBARA CA

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Clarke, Peter J Santa Barbara, CA 26 546

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