Substrate attach adhesive film, application method and devices incorporating the same
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United States of America Patent
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-
Oct 29, 1991
Grant Date -
N/A
app pub date -
Mar 20, 1990
filing date -
Mar 20, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A heat activated adhesive film is disclosed, 2-15 mil thick, for bonding a circuit-printed substrate to its support. The adhesive's main constituent is a thermoplastic organic high polymer containing the elements of carbon and hydrogen, and one or more of the elements oxygen, nitrogen, sulfur, halogen in its repeating unit. The polymer's Vicat softening temperature is 70.degree.-280.degree. C. Optionally, the adhesive may also contain up to 45 volume percent of a thermally conductive inorganic filler of 0.5-20 micrometer particle size. The attachment process simply consists of heating and pressing the film, sandwiched between the adherent surfaces, above the melting temperature and cooling to ambient.
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