Lead design to facilitate post-reflow solder joint quality inspection
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United States of America Patent
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-
Nov 5, 1991
Issued Date -
N/A
app pub date -
May 1, 1990
filing date -
Dec 20, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An improved lead for surface-mounted electronic components is described. The improved lead includes an opening through the portion of the lead to be placed in contact with the printed circuit board for soldering. The opening, having a diameter approximately equal to the thickness of the lead, enables the detection of correctly-soldered joints using automated inspection equipment. When the lead is correctly soldered, solder is drawn by capillary action into the opening where it forms a meniscus. By automatically detecting the curvature of the meniscus, the quality of the solder joint may be determined.
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