Method of compression molding on hot surfaces
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United States of America Patent
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-
Nov 12, 1991
Issued Date -
N/A
app pub date -
Nov 13, 1989
filing date -
Mar 30, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A mold structure including layers with different physical properties is used to provide hot surface during molding. The use of a thin layer of low thermal conductivity covered by a smooth skin layer prevents quick cooling of the surface of the pre-heated plastic to be molded. The plastic surface remains molten and flows to fill the mold during press closing, resulting in smooth surfaces even when fiber reinforced plastics are used.
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