Three dimensional packaging arrangement for computer systems and the like
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 12, 1991
Grant Date -
N/A
app pub date -
Jul 13, 1990
filing date -
Jul 13, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A three dimensional arrangement for packaging planar arrays of circuit components in a plurality of essentially planar layers in which the layers lie closely adjacent to one another is disclosed. Each layer is separated by a shell that interposes slots for allowing coolant to pass between the layers and electrical conductors through the shell, so that when the layers are placed together, the conductors form a bus through the structure.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully