Flex interconnect module
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United States of America Patent
Stats
-
Nov 12, 1991
Grant Date -
N/A
app pub date -
Aug 30, 1990
filing date -
Aug 30, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronic packaging module in which the inactive sides of integrated circuit chips are held in compression against a heat spreader by an elastomer pressed thereagainst by a multilayer flexible printed circuit board. A TAB frame, which may be demountable, interconnects integrated circuit chips to a multilayer flexible printed circuit board. A backing plate is fastened to a heat spreader so that it presses against the multilayer flexible printed circuit board. Contacts are compressed against the motherboard to interconnect the multilayer flexible printed circuit board thereto. Coaxial power connectors provide power and ground connections between non-peripheral portions of the multilayer flexible printed circuit board and the motherboard.
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