Molded integrated circuit package incorporating heat sink
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Nov 12, 1991
Grant Date -
N/A
app pub date -
Feb 12, 1990
filing date -
Feb 12, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A molded integrated circuit package includes an integrated circuit chip, a heat sink device attached directly to the chip or lead frame and a molded package encapsulating the chip. The heat sink preferably comprises a thermally conductive material having a stem which communicates between the IC chip and the exterior of the molded package for direct conduction of heat from the IC chip to the exterior of the package.
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