Method of manufacturing a leadframe having conductive elements preformed with solder bumps
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United States of America Patent
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Nov 19, 1991
Issued Date -
N/A
app pub date -
Sep 28, 1990
filing date -
Nov 21, 1988
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Disclosed is a composition and method for providing conductive electronic component high strength bonding. The composition comprises an effective amount of material which is less than 3% by weight of tin and greater than 97% by weight of lead. The method invention comprises providing a leadframe comprising at least one of power, ground, and signal conductive elements; and preforming solder material onto one of the conductive elements, the solder bonding material having an effective amount of material which is less than 3% by weight of tin and greater than 97% by weight of lead.
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