Electromagnetic wave shielding composition comprising epoxy resin and copper particles

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United States of America Patent

PATENT NO 5066692
SERIAL NO

07541826

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Abstract

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An electromagnetic wave shielding circuit and the production method thereof is described, wherein the circuit comprises a base board, an electric circuit formed on the base board, an electrically isolating coating coated over the electric circuit, a layer of coating having copper particles contained therein coated over the electrically isolating coating and hardened by heating, a copper plating layer attached to the surface of the copper particle containing coating for discharging out of the electric circuit an electromagnetic wave current which may be produced in the electric circuit, said copper particle containing coating having contained therein 100% by weight of copper particles and 12%-25% by weight of epoxy resin for a binder.

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Patent Owner(s)

Patent OwnerAddress
ASAHI CHEMICAL RESEARCH LABORATORY CO LTDTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Isawa, Yamahiro Hachioji, JP 1 6
Morooka, Isao Hachioji, JP 7 164
Oba, Yoichi Higasiyamato, JP 9 179

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