IC package and IC card incorporating the same thereinto
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 19, 1991
Grant Date -
N/A
app pub date -
Aug 7, 1990
filing date -
Aug 11, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An IC package comprising an integrated substrate which includes a cavity, in which an IC chip is mounted, formed by a wall surrounding the IC chip, and a groove formed in the surrounding wall extending to surround and communicate with the cavity and method for fabricating the IC package, wherein an excessive amount of resin is filled in the cavity of the integrated substrate, and the composite structure pressed by a plate whereby the excess of the resin overflows from the cavity pressure to be received in the groove such that, the exposed surface of the filled resin is formed into a predetermined shape without requiring grinding.
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