Method of forming an integrated circuit module
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United States of America Patent
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-
Nov 26, 1991
Issued Date -
N/A
app pub date -
Jan 12, 1990
filing date -
Jul 24, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of forming an integrated circuit module ae disclosed. The module includes a plurality of integrated circuit layers having beveled vertical edges along a portion thereof. The layers are connected to a contact board disposed orthogonal to the layers and also having a beveled first surface formed to receive and support the integrated circuit layers.
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