Low dielectric constant ceramic materials
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United States of America Patent
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Nov 26, 1991
Issued Date -
N/A
app pub date -
May 17, 1988
filing date -
Apr 18, 1986
priority date (Note) -
Expired
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Abstract
A dense, sintered ceramic material having a low dielectric constant, a low firing temperature, and a low coefficient of thermal expansion is provided from a mixture of 0-30 wt. % alumina, 30-60 wt. % fused silica, and 30-70 wt. % of a glass comprised of PbO, B.sub.2 O.sub.3, and SiO.sub.2. The mixture has a minimum sintering temperature in the range of 800.degree.-900.degree. C., and can be formed by conventional manufacturing techniques. It is particularly useful for the fabrication of single or multilayer electronic circuit substrates.
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