Process of making a ferroelectric electronic component and product
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United States of America Patent
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Dec 3, 1991
Grant Date -
N/A
app pub date -
Jun 26, 1989
filing date -
Jun 26, 1989
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An improved process of making a ferroelectric electronic component, such as a non-volatile RAM or an electro-optic switching array, is disclosed. The process essentially includes the separate formation of two subassemblies and then connecting them by placing one on top of the other. Electrical contacts are made by 'bumping' or other 'flip chip' techniques.
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