Method of making molded resin casing of electronic part with flat cable
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United States of America Patent
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-
Dec 10, 1991
Issued Date -
N/A
app pub date -
Dec 7, 1989
filing date -
Sep 7, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A molded resin casing of an electronic part equipped with a flat cable and internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part. A flexible board having various electric conductor patterns formed on a synthetic resin film is used as the board, the flexible board is formed integral with a flat cable including a synthetic resin film on which are formed electric conductor patterns electrically connected to the aforementioned various electric conductor patterns, and when the molded resin casing is molded by injecting a molten synthetic resin, the flexible board is inserted in such a manner that the electric conductor patterns are exposed within the casing, thereby integrating the flexible board and synthetic resin casing, with the flat cable extending outwardly from a side portion of the synthetic resin casing.
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