Epoxy resin composition for use in sealing semiconductors
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United States of America Patent
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-
Dec 17, 1991
Grant Date -
N/A
app pub date -
Oct 29, 1990
filing date -
May 8, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An epoxy resin composition for use in sealing semiconductors, having enhanced moisture resistance reliability is disclosed, which comprises an epoxy resin and an oxyacid bismuth oxyhydroxide represented by the following formula (1): Bi.sub.x O.sub.y (OH).sub.p (Y.sup.-a).sub.q (NO.sub.3).sub.r.nH.sub.2 O (1) wherein Y.sup.-a represents a residue of an oxyacid other than nitrate; a represents the ionic valence, absolute value, of the residue of the oxyacid; and x, y, p, q, r and n each represents a value satisfying the following: 1.ltoreq.x 1.ltoreq.y O.ltoreq.n 0.08 x.ltoreq.p.ltoreq.0.92 x 0.02 x.ltoreq.aq.ltoreq.0.92 x 0.ltoreq.r.ltoreq.0.1 x 3 x=2 y+p+aq+r
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