Circuit board with coated metal support structure and method for making same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Dec 17, 1991
Grant Date -
N/A
app pub date -
Oct 6, 1988
filing date -
Oct 6, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A circuit board is provided having an electrically conductive substrate. Preferably, the electrically conductive substrate comprises molybdenum and copper. The substrate is selectively coated with a dielectric material which is capable of withstanding volatilization at high temperatures. The coefficient of thermal expansion of the substrate is substantially equal to that of the circuitry components which are placed thereon. A method of providing such a support structure is also disclosed.
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