Bismaleimide-styrene compound-acid compound-containing thermosetting composition
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United States of America Patent
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Dec 24, 1991
Issued Date -
N/A
app pub date -
Nov 13, 1989
filing date -
Nov 6, 1982
priority date (Note) -
Expired
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Abstract
Thermosetting compositions consist of a homogeneous mixture of an ethylenically unsaturated compound, a bismaleimide compound or a bismaleimide containing composition and an acid compound, with optionally further copolymerizable compounds and usual additives. The thermosetting composition are useful as a coating resin, a laminating resin or for the manufacture of shaped articles.
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