Grounding an ultra high density pad array chip carrier
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United States of America Patent
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-
Dec 31, 1991
Grant Date -
N/A
app pub date -
May 1, 1989
filing date -
May 1, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A die pad (108) with a punched hole providing a throughway (110) is affixed upon the chip carrier base 100. Such throughway permits the electronic interconnection of the die backside (112) to a conductive runner (104) by electrically conductive material (110) set between the die backside (112) and the conductive runner (104).
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