Importance

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Abstract

A method for treating a main surface of a wafer on which a thin film having micro openings is formed with a treatment agent includes the steps of: making the thin film hydrophilic, supplying water to the surface of the thin film, and supplying the treatment agent in vapor phase to the thin film while spinning the wafer. The rendered hydrophilic thin film causes the water supplied to the surface of the thin film to form a water film having a uniform thickness on the inner surface of the openings as well as on the surface of the thin film. A vapor phase treatment agent supplied dissolves in the water film so as to treat the main surface of the wafer at the bottom of the openings. Even if the wafer is spun at high speed, the treatment agent permeates through the water film into the openings so as to uniformly and efficiently treat the main surface of the wafer.

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First Claim