Ceramic package type semiconductor device and method of assembling the same
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United States of America Patent
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Jan 14, 1992
Issued Date -
N/A
app pub date -
May 10, 1991
filing date -
Feb 10, 1989
priority date (Note) -
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status (Latency Note)
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Abstract
A ceramic package type semiconductor device comprising: a ceramic substrate having a wiring pattern layer formed on a top surface thereof; at least one semiconductor element mounted on the ceramic substrate with a top face thereof facing downward and electrically connected to the wiring patttern layer; a metal cap having at least one through-hole corresponding to an external size of the semiconductor element and an end portion thereof soldered to the top surface of the ceramic substrate, so that a top surface of the metal cap and a bottom surface of the semiconductor element fitting into the through-hole form a flat plane: and a heatsink member comprising a plate portion which is soldered to the flat plane of the metal cap and the semiconductor element to complete a hermetic sealing of the semiconductor element.
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