Multi-layer package incorporating a recessed cavity for a semiconductor chip
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 14, 1992
Grant Date -
N/A
app pub date -
Apr 27, 1990
filing date -
Apr 27, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronic component package, including: a multilayer ceramic or glass-ceramic substrate formed of a stacked plurality of generally parallel signal and insulating layers, each of the signal layers comprising an electrically conductive pattern; a cavity in a surface of the substrate sized to accommodate an electronic component with a planar surface of the electronic component disposed substantially planar with the surface of the substrate; and a plurality of electrical conductors extending from the surface of the substrate to selected ones of the signal layers for connecting the electronic component to the signal layers. Thin film wiring is provided for connecting the electronic component to the substrate.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully