Method of soldering honeycomb body

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United States of America Patent

PATENT NO 5082167
SERIAL NO

07583331

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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When soldering a honeycomb body formed by alternately piling flat foils (plates) and corrugated foils (plates), a binder liquid is sucked up from the end face of the honeycomb body to form a binder streak in a space defined by contacting portions of the flat foil (plate) and corrugated foil (plate), a solder is scattered and applied onto the binder streak, and the honeycomb body is then dried and heated to effect a soldering of the honeycomb body. According to this method, soldering can be accomplished only in the vicinity of the contacting portions of the flat foil (plate) and corrugated foil (plate), with a desired soldering structure.

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Patent Owner(s)

  • NIPPON KINZOKU CO., LTD.;NIPPON STEEL CORPORATION;TOYOTA JIDOSHA KABUSHIKI KAISHA

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aoyagi, Hikaru Tokyo, JP 10 90
Kasahara, Akihiko Tokyo, JP 10 59
Kawasaki, Takatoshi Tokyo, JP 2 13
Nakashima, Yuuji Kimitsu, JP 5 40
Nishizawa, Yoshio Tokyo, JP 9 56
Sadano, Yutaka Kimitsu, JP 8 127
Shibata, Shinji Toyota, JP 68 790
Tanaka, Takashi Sagamihara, JP 315 3231

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