Three dimensional binding site array for interfering with an electrical field
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United States of America Patent
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Jan 21, 1992
Grant Date -
N/A
app pub date -
May 1, 1987
filing date -
May 1, 1987
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A dielectric material of a capacitive affinity sensor has a three-dimensional molecular binding site array. A glass base is layered with a binding agent like silane from which a polymeric backbone like polylysine extends. The polymeric backbone is prepared to accept receptor molecules like cortisol hemisuccinate to bind a specific antibody. Such an array changes dielectric properties between the two electrodes of the capacitive affinity sensor to greatly enhance sensitivity of the sensor.
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