System for manufacturing semiconductor substrates
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United States of America Patent
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Jan 28, 1992
Grant Date -
N/A
app pub date -
Mar 20, 1990
filing date -
Oct 20, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A system for manufacturing substrates, in particular wafers, glass masks, and channels, having individual process stations for treating and/or processing the various substrates in a clean environment. A plurality of interchangeable and aligned process modules are provided which are connected and disconnected from a media bus in which inflow and outflow lines are situated. These lines serve to supply the process modules through the noted connection with chemicals, gases, liquids, data and energy as needed.
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