Particle-enhanced joining of metal surfaces

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United States of America Patent

PATENT NO 5083697
SERIAL NO

07479696

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Abstract

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A method for joining a first metal surface to a second metal surface employs metallized particles or protuberances disposed between said surfaces. The metallized particles include a core particulate composed of a material having a hardness greater than that of the metals to be bonded. By compressing the metal surfaces together in a generally normal or perpendicular direction, one or both of the metal surfaces is compressed into a metal region formed around the particulate core. In this way, very high local regions of stress are created which cause the metal to elastoplastically deform, enhancing the ability to form diffusion bonds. Alternatively, temporary electrical or other junctions may be formed by bringing the surfaces together under less rigorous conditions and/or using metals which are incapable of forming diffusion bonds.

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Patent Owner(s)

Patent OwnerAddress
NANOPIERCE TECHNOLOGIES INCSUITE 3580 370 SEVENTEENTH STREET DENVER CO 80202

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Difrancesco, Louis 31032 Hershey Wy, Hayward, CA 94544 15 837

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